Search
IAS Distinguished Lecture
On Thermal Conductive Polymer Composites as Underfill Materials for Electronic Packaging

Prof MAI Yiu-Wing

University Chair and Professor of Mechanical Engineering, The University of Sydney; IAS Senior Visiting Fellow

MTPC Job No: V19874
Duration: 1:25:29
Shooting Date: 5/8/2019
Views: 2842
More in Lecture & Forum
Share this Video

 

 

 

 

 

All Videos
Page 1 of 5
On Thermal Conductive Polymer Composites as Underfill Materials for Electronic Packaging
5/8/2019
The Origin of Classical General Relativity and Gauge Theory
30/7/2019
Summer Showcase Concert
12/7/2019
Smart Investment
20/5/2019
Genomics in Neurodegenerative Disease – What Are We Up To
20/5/2019
HUMA Music Course Showcase II
9/5/2019
“五四之後:當代人文的三個方向 -夏志清、李歐梵、劉再復”國際學術研討會
9/5/2019
Design Evaluation
8/5/2019
Antecedents and Consequences of Counterfeit Consumption
8/5/2019
HUMA Music Course Showcase I
8/5/2019